Invention Grant
- Patent Title: Heating apparatus, heat treatment apparatus, and heating method
- Patent Title (中): 加热装置,热处理装置和加热方法
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Application No.: US13420257Application Date: 2012-03-14
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Publication No.: US09273373B2Publication Date: 2016-03-01
- Inventor: Hitoshi Nakatsu , Hisaaki Watanabe
- Applicant: Hitoshi Nakatsu , Hisaaki Watanabe
- Applicant Address: JP Tokyo JP Shizuoka
- Assignee: NETUREN CO., LTD.,NETUREN TAKUTO CO., LTD.
- Current Assignee: NETUREN CO., LTD.,NETUREN TAKUTO CO., LTD.
- Current Assignee Address: JP Tokyo JP Shizuoka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2011-057309 20110315; JP2011-057310 20110315
- Main IPC: H05B6/02
- IPC: H05B6/02 ; C21D9/40 ; C21D1/42 ; F27B9/16 ; F27B9/36 ; C21D9/00 ; C21D9/673 ; C21D9/677

Abstract:
A heating apparatus, a heat treatment apparatus, and a heating method are provided. The heating apparatus includes a workpiece support on which a ring-shaped workpiece is placed, a rotary drive assembly, and a heater configured to heat the workpiece. The workpiece support includes a plurality of rotating rollers arranged in a circumferential direction. The rotary drive assembly is configured to rotate the plurality of rotating rollers to rotate the workpiece placed on the workpiece support along a ring shape of the workpiece. The heater includes a heating coil configured to induction-heat the workpiece on the workpiece support at a heating position, and an actuator configured to move the heating coil at the heating position relative to the workpiece to adjust a distance between the workpiece and the heating coil.
Public/Granted literature
- US20120234824A1 Heating Apparatus, Heat Treatment Apparatus, and Heating Method Public/Granted day:2012-09-20
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