Invention Grant
- Patent Title: Modular void form
- Patent Title (中): 模块化void形式
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Application No.: US14409666Application Date: 2013-06-18
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Publication No.: US09273476B2Publication Date: 2016-03-01
- Inventor: Terry Hoyle
- Applicant: Terry Hoyle
- Agency: Leyendecker & Lemire, LLC
- International Application: PCT/US2013/046244 WO 20130618
- International Announcement: WO2013/192141 WO 20131227
- Main IPC: E04G15/06
- IPC: E04G15/06 ; E04G9/00 ; B28B7/34 ; E04G9/08 ; B28B23/00 ; E04G9/02

Abstract:
A modular void form is described. Embodiments of the modular void form can include a panel and at least one reinforcement member. The panel can include one or more scoring lines which the panel can be folded about. When the panel is folded, a tubular structure having a flange can be formed. The panel can include a plurality of slits that form slots when the panel is folded. The reinforcement members can be adapted to be removably inserted into the slots of the panel and engage the flange of the folded panel.
Public/Granted literature
- US20150191921A1 MODULAR VOID FORM Public/Granted day:2015-07-09
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