Invention Grant
US09274142B2 Testing system with capacitively coupled probe for evaluating electronic device structures
有权
具有电容耦合探头的测试系统用于评估电子设备结构
- Patent Title: Testing system with capacitively coupled probe for evaluating electronic device structures
- Patent Title (中): 具有电容耦合探头的测试系统用于评估电子设备结构
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Application No.: US13097847Application Date: 2011-04-29
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Publication No.: US09274142B2Publication Date: 2016-03-01
- Inventor: Joshua G. Nickel , Jr-Yi Shen
- Applicant: Joshua G. Nickel , Jr-Yi Shen
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent G. Victor Treyz; Joseph F. Guihan
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R1/07 ; G01R31/312

Abstract:
Conductive electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that has a capacitive coupling probe. The probe may have electrodes. The electrodes may be formed from patterned metal structures in a dielectric substrate. A test unit may provide radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be applied to the conductive housing member or other conductive structures under test using the electrodes. Complex impedance data, forward transfer coefficient data, or other data may be used to determine whether the structures are faulty. A fixture may be used to hold the capacitive coupling probe in place against the conductive electronic device structures during testing.
Public/Granted literature
- US20120274346A1 TESTING SYSTEM WITH CAPACITIVELY COUPLED PROBE FOR EVALUATING ELECTRONIC DEVICE STRUCTURES Public/Granted day:2012-11-01
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