Invention Grant
- Patent Title: Detection apparatus for light-emitting diode chips having a light sensing device receiving light beams penetrated through a transparent chuck
- Patent Title (中): 具有接收透过透明卡盘的光束的感光装置的发光二极管芯片的检测装置
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Application No.: US13836762Application Date: 2013-03-15
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Publication No.: US09274164B2Publication Date: 2016-03-01
- Inventor: Tai-Wei Wu , Tai-Cheng Tsai , Gwo-Jiun Sheu , Shou-Wen Hsu , Yun-Li Li
- Applicant: GENESIS PHOTONICS INC
- Applicant Address: TW Tainan
- Assignee: GENESIS PHOTONICS INC.
- Current Assignee: GENESIS PHOTONICS INC.
- Current Assignee Address: TW Tainan
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW101135666A 20120927
- Main IPC: G01R1/073
- IPC: G01R1/073 ; G01R31/26 ; G01R31/44 ; G01R1/04 ; G02B3/00 ; G01J1/04 ; G01J1/42 ; H01L33/00

Abstract:
A detection apparatus for light-emitting diode chips comprises a transparent chuck with the light-concentration capability, a probing device and a light-sensing device. The transparent chuck comprises a light-incident plane and a light-emitting plane. The light-incident plane is used to bear a plurality of light-emitting diode chips under detection. The probing device comprises two probe pins and a power supply. The two ends of each probe pin is electrically connected to one of the light-emitting diode chips and the power supply, respectively, to make the light-emitting diode chip emit a plurality of light beams. The light beams penetrate through the transparent chuck by emitting into the incident plane of the transparent chuck. The light-sensing device is disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck.
Public/Granted literature
- US20140084931A1 DETECTION APPARATUS FOR LIGHT-EMITTING DIODE CHIPS Public/Granted day:2014-03-27
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