Invention Grant
- Patent Title: Resist composition and resist pattern forming method
- Patent Title (中): 抗蚀剂组成和抗蚀剂图案形成方法
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Application No.: US14219395Application Date: 2014-03-19
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Publication No.: US09274424B2Publication Date: 2016-03-01
- Inventor: Tsuyoshi Nakamura , Kazuishi Tanno , Naoto Motoike , Junichi Tsuchiya , Yoichi Hori
- Applicant: Tokyo Ohka Kogyo Co., Ltd.
- Applicant Address: JP Kawasaki-Shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2013-062866 20130325
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/038 ; G03F7/20 ; G03F7/30 ; G03F7/004

Abstract:
A resist composition which generates an acid upon exposure and exhibits changed solubility in a developing solution by the action of the acid contains a high-molecular weight compound (A1) having a constituent unit (a0) represented by a general formula (a0-1) and a constituent unit (a1-1) including a monocyclic group-containing acid decomposable group whose polarity increases by the action of an acid. In the formula (a0-1), R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms; Ya01 represents a single bond or a divalent linking group; X01 represents a sulfur atom or an oxygen atom; and Ra01 represents an optionally substituted cyclic group, chain alkyl group, or chain alkenyl group.
Public/Granted literature
- US20140287362A1 RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD Public/Granted day:2014-09-25
Information query
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