Invention Grant
- Patent Title: Detachable assembly and memory module using the same
- Patent Title (中): 可拆卸组件和内存模块使用相同
-
Application No.: US13862411Application Date: 2013-04-13
-
Publication No.: US09274569B2Publication Date: 2016-03-01
- Inventor: Yujen Yang
- Applicant: ADATA TECHNOLOGY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: ADATA TECHNOLOGY CO., LTD.
- Current Assignee: ADATA TECHNOLOGY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: TW102103473A 20130130
- Main IPC: G06F1/18
- IPC: G06F1/18

Abstract:
The instant disclosure relates to a memory module comprising a PCB and a detachable assembly. The PCB has a terminal portion and a free portion away from the terminal portion. The detachable assembly includes a plurality of metal members disposed on the free portion of the PCB. Thereby, user can averagely force the metal members to install or detach the memory module from a memory slot of a computer system to prevent the interference of outer ESD to affect the normal function of PCB.
Public/Granted literature
- US20140211404A1 DETACHABLE ASSEMBLY AND MEMORY MODULE USING THE SAME Public/Granted day:2014-07-31
Information query