Invention Grant
- Patent Title: Placing transistors in proximity to through-silicon vias
-
Application No.: US14674462Application Date: 2015-03-31
-
Publication No.: US09275182B2Publication Date: 2016-03-01
- Inventor: James David Sproch , Victor Moroz , Xiaopeng Xu , Aditya Pradeep Karmarkar
- Applicant: Synopsys, Inc.
- Applicant Address: US CA Mountain View
- Assignee: Synopsys, Inc.
- Current Assignee: Synopsys, Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Haynes Beffel & Wolfeld LLP
- Agent Kenta Suzue
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L21/768 ; H01L27/02 ; H01L29/78 ; H01L21/8238

Abstract:
Roughly described, the invention involves ways to characterize, take account of, or take advantage of stresses introduced by TSV's near transistors. The physical relationship between the TSV and nearby transistors can be taken into account when characterizing a circuit. A layout derived without knowledge of the physical relationships between TSV and nearby transistors, can be modified to do so. A macrocell can include both a TSV and nearby transistors, and a simulation model for the macrocell which takes into account physical relationships between the transistors and the TSV. A macrocell can include both a TSV and nearby transistors, one of the transistors being rotated relative to others. An IC can also include a transistor in such proximity to a TSV as to change the carrier mobility in the channel by more than the limit previously thought to define an exclusion zone.
Public/Granted literature
- US20150205904A1 PLACING TRANSISTORS IN PROXIMITY TO THROUGH-SILICON VIAS Public/Granted day:2015-07-23
Information query