Invention Grant
- Patent Title: Semiconductor chips
- Patent Title (中): 半导体芯片
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Application No.: US13965887Application Date: 2013-08-13
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Publication No.: US09275687B2Publication Date: 2016-03-01
- Inventor: Yin Jae Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2013-0014155 20130207
- Main IPC: G11C5/02
- IPC: G11C5/02 ; G11C8/12

Abstract:
A semiconductor chip includes a core region having a plurality of first memory cells and a first edge adjacent to a first side of the core region. The first edge includes a first region and a second region. The first region includes a plurality of second memory cells, and the second region includes a first pad portion through which at least one of an address signal, a command signal, a clock signal, a data signal and a control signal is inputted or outputted.
Public/Granted literature
- US20140218995A1 SEMICONDUCTOR CHIPS Public/Granted day:2014-08-07
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