Invention Grant
- Patent Title: Multi-chip module with rework capability
- Patent Title (中): 具有返修能力的多芯片模块
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Application No.: US14456025Application Date: 2014-08-11
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Publication No.: US09275879B1Publication Date: 2016-03-01
- Inventor: Michael A. Gaynes , Jeffrey D. Gelorme , Jae-Woong Nah
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Daniel P. Morris
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/56 ; H01L21/66 ; C08G59/24 ; C08G59/50 ; H01L21/60
Abstract:
Multi-chip underfills and methods for multi-chip module fabrication include connecting one or more chips to a substrate with one or more electrical connections; partially curing an underfill material such that the underfill provides structural support to the electrical connections; electrically testing the one or more chips to identify one or more defective chips; and replacing the one or more defective chips.
Public/Granted literature
- US20160042979A1 MULTI-CHIP MODULE WITH REWORK CAPABILITY Public/Granted day:2016-02-11
Information query
IPC分类:
