Invention Grant
US09275924B2 Semiconductor package having a recess filled with a molding compound
有权
具有填充有模塑料的凹部的半导体封装
- Patent Title: Semiconductor package having a recess filled with a molding compound
- Patent Title (中): 具有填充有模塑料的凹部的半导体封装
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Application No.: US13585500Application Date: 2012-08-14
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Publication No.: US09275924B2Publication Date: 2016-03-01
- Inventor: Tsung-Ding Wang , Jung Wei Cheng , Bo-I Lee
- Applicant: Tsung-Ding Wang , Jung Wei Cheng , Bo-I Lee
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/31 ; H01L23/00 ; H01L21/00
Abstract:
A semiconductor package includes a passivation layer overlying a semiconductor substrate, a bump overlying the passivation layer, and a molding compound layer overlying the passivation layer and covering a lower portion of the bump. A sidewall of the passivation layer is covered by the molding compound layer.
Public/Granted literature
- US20140048926A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-02-20
Information query
IPC分类:
