Invention Grant
US09275966B2 Semiconductor device apparatus and assembly with opposite die orientations
有权
具有相反芯片取向的半导体器件装置和组件
- Patent Title: Semiconductor device apparatus and assembly with opposite die orientations
- Patent Title (中): 具有相反芯片取向的半导体器件装置和组件
-
Application No.: US13529595Application Date: 2012-06-21
-
Publication No.: US09275966B2Publication Date: 2016-03-01
- Inventor: Josef C. Drobnik
- Applicant: Josef C. Drobnik
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Lempia Summerfield Katz LLC
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00 ; H01L23/64 ; H01L25/07 ; H01L23/50
Abstract:
An electronic apparatus includes a base substrate, the base substrate including an interconnect. The electronic apparatus further includes a first die including a first semiconductor device, the first semiconductor device being coupled to the interconnect, and further includes a second die including a second semiconductor device, the second semiconductor device being coupled to the interconnect. The first and second die are attached to the base substrate in opposite orientations.
Public/Granted literature
- US20130341776A1 Semiconductor Device Apparatus and Assembly with Opposite Die Orientations Public/Granted day:2013-12-26
Information query
IPC分类:
