Invention Grant
- Patent Title: Multi-chip package system
- Patent Title (中): 多芯片封装系统
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Application No.: US13935966Application Date: 2013-07-05
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Publication No.: US09275984B2Publication Date: 2016-03-01
- Inventor: Chun-Seok Jeong
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2013-0040066 20130411
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L27/02 ; G11C5/06 ; G11C29/02 ; G11C7/20 ; G11C8/12
Abstract:
A multi-chip package system includes a signal transmission line commonly coupled to a plurality of semiconductor chips to transfer data to/from the semiconductor chips from/to outside; and a termination controller suitable for detecting a loading value of the signal transmission line and controlling a termination operation on the signal transmission line based on the loading value.
Public/Granted literature
- US20140306753A1 MULTI-CHIP PACKAGE SYSTEM Public/Granted day:2014-10-16
Information query
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