Invention Grant
US09276007B2 System and method for manufacturing self-aligned STI with single poly
有权
用单晶制造自对准STI的系统和方法
- Patent Title: System and method for manufacturing self-aligned STI with single poly
- Patent Title (中): 用单晶制造自对准STI的系统和方法
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Application No.: US14167845Application Date: 2014-01-29
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Publication No.: US09276007B2Publication Date: 2016-03-01
- Inventor: Tim Thurgate , Shenqing Fang , Kuo-Tung Chang , YouSeok Suh , Meng Ding , Hidehiko Shiraiwa , Amol Joshi , Hapreet Sachar , David Matsumoto , Lovejeet Singh , Chih-Yuh Yang
- Applicant: SPANSION LLC
- Applicant Address: US CA San Jose
- Assignee: Cypress Semiconductor Corporation
- Current Assignee: Cypress Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L21/8234 ; H01L21/762 ; H01L21/28 ; H01L29/66

Abstract:
A method for fabricating a memory device with a self-aligned trap layer and rounded active region corners is disclosed. In the present invention, an STI process is performed before any of the charge-trapping and top-level layers are formed. Immediately after the STI process, the sharp corners of the active regions are exposed. Because these sharp corners are exposed at this time, they are available to be rounded through any number of known rounding techniques. Rounding the corners improves the performance characteristics of the memory device. Subsequent to the rounding process, the charge-trapping structure and other layers can be formed by a self-aligned process.
Public/Granted literature
- US20140312409A1 SYSTEM AND METHOD FOR MANUFACTURING SELF-ALIGNED STI WITH SINGLE POLY Public/Granted day:2014-10-23
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