Invention Grant
- Patent Title: High electron mobility transistor and method of manufacturing the same
- Patent Title (中): 高电子迁移率晶体管及其制造方法
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Application No.: US14532699Application Date: 2014-11-04
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Publication No.: US09276098B2Publication Date: 2016-03-01
- Inventor: Hong-Pyo Heo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0103608 20120918
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/778 ; H01L29/10 ; H01L29/45 ; H01L29/49 ; H01L29/78 ; H01L29/06 ; H01L29/08 ; H01L29/20

Abstract:
According to example embodiments, a high electron mobility transistor (HEMT) includes a first semiconductor layer on a substrate and a second semiconductor layer on the first semiconductor layer. The first and second semiconductor layers define a recessed region. A semiconductor doped layer is in the recessed region of first and second semiconductor layers. A 2-dimensional electron gas (2DEG) region is at a portion of the first semiconductor layer adjacent to both sides of the semiconductor doped layer.
Public/Granted literature
- US20150054035A1 HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-02-26
Information query
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