Invention Grant
- Patent Title: Silicon carbide semiconductor device and method for manufacturing same
- Patent Title (中): 碳化硅半导体器件及其制造方法
-
Application No.: US14651985Application Date: 2013-12-04
-
Publication No.: US09276106B2Publication Date: 2016-03-01
- Inventor: Keiji Wada , Takeyoshi Masuda , Toru Hiyoshi
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori
- Priority: JP2013-008104 20130121
- International Application: PCT/JP2013/082560 WO 20131204
- International Announcement: WO2014/112233 WO 20140724
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/78 ; H01L29/16 ; H01L29/06 ; H01L29/423 ; H01L29/66

Abstract:
A silicon carbide film includes a first range having a first breakdown voltage holding layer, a charge compensation region, a first junction terminal region, and a first guard ring region. The silicon carbide film includes a second range having a second breakdown voltage holding layer, a channel forming region, and a source region. The first and second breakdown voltage holding layers constitutes a breakdown voltage holding region having a thickness in an element portion. When voltage is applied to attain a maximum electric field strength of 0.4 MV/cm or more in the breakdown voltage holding region during an OFF state, a maximum electric field strength in the second range within the element portion is configured to be less than ⅔ of a maximum electric field strength in the first range.
Public/Granted literature
- US20150372128A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2015-12-24
Information query
IPC分类: