Invention Grant
- Patent Title: LED module
- Patent Title (中): LED模块
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Application No.: US14487725Application Date: 2014-09-16
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Publication No.: US09276184B2Publication Date: 2016-03-01
- Inventor: Kentaro Mineshita
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2008-189756 20080723
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/48 ; H01L33/54 ; H01L25/16

Abstract:
An LED module A1 includes an LED chip 1, a lead group 4 including a lead 4A on which the LED chip 1 is mounted and a lead 4B spaced apart from the lead 4A, a resin package 2 covering part of the lead group 4, and mounting terminals 41 and 42 provided by part of the lead group 4 that is exposed from the resin package 2 and spaced apart from each other in direction x. The LED module further includes a mounting terminal 43 spaced apart from the mounting terminal 41 in direction y, and a mounting terminal 44 spaced apart from the mounting terminal 42 in direction y. This arrangement allows the LED module A1 to be mounted at a correct position on a circuit board.
Public/Granted literature
- US20150001575A1 LED MODULE Public/Granted day:2015-01-01
Information query
IPC分类: