Invention Grant
- Patent Title: Laser module
- Patent Title (中): 激光模块
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Application No.: US14336504Application Date: 2014-07-21
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Publication No.: US09276376B2Publication Date: 2016-03-01
- Inventor: Su Hwan Oh , Oh Kee Kwon
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2013-0135634 20131108
- Main IPC: H01S5/024
- IPC: H01S5/024 ; H01S5/022 ; H01S5/40
Abstract:
A laser module includes a Transmitter Optical Sub-Assembly (TOSA) and a heat radiating means. The TOSA generates light by an electrical signal and transmits the generated light through an optical fiber. The heat radiating means is in contact with the TOSA to discharge heat generated by the TOSA.
Public/Granted literature
- US20150131687A1 LASER MODULE Public/Granted day:2015-05-14
Information query
