An electronic assembly includes an electronic component and a base. The electronic component and another electronic component have first and second thicknesses respectively. The first thickness is greater than the second thickness. The base includes a main body having a slot, a supporting element movably disposed at the main body, and a first elastic element connected between the main body and the supporting element. When the supporting element is at a first position, the supporting element is hidden in the main body, and the electronic component having the first thickness is adapted to be inserted into the slot. When the supporting element is moved to a second position by an elastic force of the first elastic element, at least part of the supporting element is in the slot, and the electronic component having the second thickness is adapted to be inserted into the slot and supported by the supporting element.