Invention Grant
- Patent Title: Electromagnetic interference filter assembly
- Patent Title (中): 电磁干扰滤波器组件
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Application No.: US14186144Application Date: 2014-02-21
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Publication No.: US09276546B2Publication Date: 2016-03-01
- Inventor: Evan Lawrence Craig
- Applicant: TYCO ELECTRONICS CORPORATION
- Applicant Address: US PA Berwyn
- Assignee: TYCO ELECTRONICS CORPORATION
- Current Assignee: TYCO ELECTRONICS CORPORATION
- Current Assignee Address: US PA Berwyn
- Main IPC: H03H1/00
- IPC: H03H1/00 ; H01F17/06 ; H03H7/01 ; H03H7/42 ; H01F27/26

Abstract:
An assembly and method for providing electromagnetic interference isolation. The assembly includes an enclosure which has a first panel and a second panel. Bus bars extend through the first panel and the second panel. A mounting plate is positioned between the first panel and the second panel. The mounting plate has locating members thereon. A plurality of inductive cores are positioned proximate the locating members, the inductive cores having openings through which the bus bars extend. The inductive cores are precisely positioned in the enclosure to facilitate the electromagnetic interference isolation.
Public/Granted literature
- US20150244339A1 ELECTROMAGNETIC INTERFERENCE FILTER ASSEMBLY Public/Granted day:2015-08-27
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