Invention Grant
- Patent Title: Via system of printed circuit board and method of making same
- Patent Title (中): 通过印刷电路板系统及其制作方法
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Application No.: US14485312Application Date: 2014-09-12
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Publication No.: US09276549B1Publication Date: 2016-03-01
- Inventor: Ming-Hsien Cheng , Po-Chuan Hsieh , Ying-Tso Lai , Chien-Hsun Chen
- Applicant: ScienBiziP Consulting (Shen Zhen) Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: ScienBiziP Consulting(Shenzhen)Co., Ltd.
- Current Assignee: ScienBiziP Consulting(Shenzhen)Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H03H7/38 ; G06F17/50

Abstract:
A printed circuit board (PCB) includes a top outer layer, a bottom outer layer, a signal transmission layer, an inner signal transmission layer, and a via system defined in the PCB. The via system includes two pairs of vias configured to transmit signals from a transmitter to a receiver. A signal transmission pathway is defined in the top outer layer, the signal transmission layer, and the inner signal transmission layer. Signals are sent from the transmitter to a first pair of vias, the signals are transmitted from the first pair of vias to a second pair of vias, and the signals are sent from the second pair of vias to the receiver. The two pairs of vias and the signal transmission pathway provide impedance matching to the signals.
Public/Granted literature
- US20160079950A1 VIA SYSTEM OF PRINTED CIRCUIT BOARD AND METHOD OF MAKING SAME Public/Granted day:2016-03-17
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