An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. The wiring substrate is disposed within the container through the first support and the second support which penetrate the container. Each of the first support and the second support includes a protrusion portion protruding outside the container, and the protrusion portion of the second support is shorter than the protrusion portion of the first support.