Invention Grant
- Patent Title: Integrated circuit chip inductor configuration
- Patent Title (中): 集成电路芯片电感配置
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Application No.: US14151943Application Date: 2014-01-10
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Publication No.: US09276616B2Publication Date: 2016-03-01
- Inventor: Michael John Story
- Applicant: QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.
- Applicant Address: GB Cambridge
- Assignee: Qualcomm Technologies International, Ltd.
- Current Assignee: Qualcomm Technologies International, Ltd.
- Current Assignee Address: GB Cambridge
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/18 ; H01F17/00 ; H01F27/34

Abstract:
An integrated circuit chip including a first inductor; a second inductor having n1 turns and located a distance r1 from the first inductor; and a third inductor having n2 turns and located a distance r2 from the first inductor; wherein the second and third inductors are coupled so as to cause current to circulate around the second inductor in a first rotational direction and around the third inductor in a second rotational direction opposite to the first rotational direction; and wherein n1, n2, r1 and r2 are such that current induced in the first inductor due to magnetic coupling from the second inductor is negated by current induced in the first inductor due to magnetic coupling from the third inductor.
Public/Granted literature
- US20150200052A1 INTEGRATED CIRCUIT CHIP INDUCTOR CONFIGURATION Public/Granted day:2015-07-16
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