Invention Grant
- Patent Title: Circuit bundle for resiliency/protection of circuits
- Patent Title (中): 用于电路弹性/保护的电路束
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Application No.: US11858031Application Date: 2007-09-19
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Publication No.: US09276769B2Publication Date: 2016-03-01
- Inventor: Man-Tung T. Hsiao , Lisa H. Nguyen , Yung-Ching Tseng , Rajiv Goel
- Applicant: Man-Tung T. Hsiao , Lisa H. Nguyen , Yung-Ching Tseng
- Applicant Address: US IL Naperville
- Assignee: Coriant Operations, Inc.
- Current Assignee: Coriant Operations, Inc.
- Current Assignee Address: US IL Naperville
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Main IPC: H04L12/28
- IPC: H04L12/28 ; H04L12/46 ; H04L12/24 ; H04L12/701 ; H04L12/707 ; H04L12/703 ; H04L12/723

Abstract:
A device having circuit bundles and a method of configuring the network device to provide resiliency and protection for network circuits. A circuit bundle provides the ability to group multiple circuits of the same type for resiliency/protection. There is an active virtual circuit that is selected based on a user configured priority value defining priority for carrying circuit traffic. When the active virtual circuit fails, alternative virtual circuits are selected to carry the circuit traffic, again based on user configured priority. Virtual circuits included in the circuit bundle can have different destinations, and include at least multipoint virtual circuits.
Public/Granted literature
- US20090109869A1 CIRCUIT BUNDLE FOR RESILIENCY/PROTECTION OF CIRCUITS Public/Granted day:2009-04-30
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