Invention Grant
- Patent Title: Suspension for a sound transducer
- Patent Title (中): 悬挂声音传感器
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Application No.: US13952919Application Date: 2013-07-29
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Publication No.: US09277305B2Publication Date: 2016-03-01
- Inventor: Joong Hak Kwon , Ho Il Jeong , Kyu Dong Choi , In Ho Jeong
- Applicant: Em-Tech. Co., Ltd.
- Applicant Address: KR Busan
- Assignee: EM-TECH. Co., Ltd.
- Current Assignee: EM-TECH. Co., Ltd.
- Current Assignee Address: KR Busan
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: KR10-2012-0082971 20120730
- Main IPC: H04R7/10
- IPC: H04R7/10 ; H04R1/02 ; H04R7/20 ; H04R9/04

Abstract:
An object of the present invention is to provide a suspension for a sound transducer which has a central portion serving as a center diaphragm and which has a cover layer and a copper pattern partially removed to prevent a decrease in sound pressure from being caused by an increase in weight of a vibration system. According to the present invention, there is provided a suspension for a sound transducer which includes a central portion, a peripheral portion, and a support portion for connecting the central portion to the peripheral portion, the suspension comprising: a base film, a conductive film attached on the base film by means of an adhesive, and a cover layer attached on the conductive film by an adhesive, wherein at least part of the cover layer disposed on the central portion is removed.
Public/Granted literature
- US20140029784A1 SUSPENSION FOR A SOUND TRANSDUCER Public/Granted day:2014-01-30
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