Invention Grant
- Patent Title: Imprinted bi-layer micro-structure method
- Patent Title (中): 印刷双层微结构法
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Application No.: US14012216Application Date: 2013-08-28
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Publication No.: US09277642B2Publication Date: 2016-03-01
- Inventor: Ronald Steven Cok
- Applicant: Eastman Kodak Company
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent Raymond L. Owens; William R. Zimmerli
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/46 ; H05K3/12 ; H05K3/00 ; H05K1/09

Abstract:
A method of making an imprinted micro-wire structure includes providing a substrate having an edge area and a central area separate from the edge area and providing first, second, and third different stamps. A curable bottom, connecting layer, and top layer are formed on the substrate. A bottom-layer micro-channel is imprinted in the bottom layer in the central area and the edge area, a connecting-layer micro-channel is imprinted in the connecting layer in the edge area over the bottom-layer micro-channel, an edge micro-channel is imprinted in the top layer in the edge area over the connecting-layer micro-channel, and top-layer micro-channels are imprinted in the top layer over the central area. Micro-wires are formed in each micro-channel. The bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire.
Public/Granted literature
- US20150060394A1 IMPRINTED BI-LAYER MICRO-STRUCTURE METHOD Public/Granted day:2015-03-05
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