Invention Grant
- Patent Title: Printed wiring board and information processing apparatus
- Patent Title (中): 印刷线路板和信息处理设备
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Application No.: US14570290Application Date: 2014-12-15
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Publication No.: US09277648B2Publication Date: 2016-03-01
- Inventor: Shotaro Hamao , Yoshiaki Tamura , Toshiki Kurosawa
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2014-006969 20140117
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A printed wiring board having a land for surface-mounting of an electronic component, includes the land having a pair of land pieces arranged in an opposing manner, and each of the land pieces including a plurality of land portions having widths different from each other, and a coupling portion partially coupling a boundary portion between a pair of adjacent ones of the land portions.
Public/Granted literature
- US20150208503A1 PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS Public/Granted day:2015-07-23
Information query
