Invention Grant
- Patent Title: Cooling an electronic device using a thermally conductive loop
- Patent Title (中): 使用导热环冷却电子设备
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Application No.: US14107121Application Date: 2013-12-16
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Publication No.: US09277677B2Publication Date: 2016-03-01
- Inventor: Bret P. Elison , Phillip V. Mann , Arden L. Moore , Arvind K. Sinha
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Scott S. Dobson; Robert Williams
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.
Public/Granted literature
- US20150156923A1 ELECTRONIC DEVICE COOLING Public/Granted day:2015-06-04
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