Invention Grant
- Patent Title: Heat sink fin including angular dimples
- Patent Title (中): 散热片包括角凹坑
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Application No.: US13207062Application Date: 2011-08-10
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Publication No.: US09277679B2Publication Date: 2016-03-01
- Inventor: Yuandong Gu , Wei Yang
- Applicant: Yuandong Gu , Wei Yang
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20 ; H01L21/48 ; H01L23/367 ; H01L23/467
Abstract:
A heat sink fin that has a first substrate. The first substrate includes a first angular dimple and a first micro air channel in fluid communication with the first angular dimple. The first angular dimple includes a first surface that forms an angle relative to a first plane of the first substrate. The first angular dimple includes a first micro diameter hole in fluid communication with the first angular dimple. The heat sink fin also has a second substrate folded against the first substrate. The second substrate includes a second angular dimple and a second micro air channel in fluid communication with the second angular dimple. The second angular dimple includes a second surface that forms an angle relative to a second plane of the second substrate. The second angular dimple includes a second micro diameter hole in fluid communication with the second angular dimple.
Public/Granted literature
- US20120132410A1 HEAT SINK FIN FORMING PROCESS Public/Granted day:2012-05-31
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