A method of bonding or debonding objects includes providing a first object including a first substrate with moveable features thereon which provide an actuated and a non-actuated state having different protrusion from the first substrate or a different curvature. A second object has an array of loops thereon. The moveable features while in one of the actuated state and non-actuated state are positioned, sized and shaped to fit within the loops. The moveable features include or are mechanically coupled to a material which responds to application of an actuating condition including electrical current, temperature, or an electromagnetic field by changing between the actuated state and the non-actuated state. Electrical current, temperature, or an electromagnetic field is automatically applied or changed to trigger a state change between the actuated state and non-actuated state that results in a bonding event or a debonding event between the first object and the second object.