Invention Grant
- Patent Title: MEMS jetting structure for dense packing
- Patent Title (中): MEMS喷射结构用于密集包装
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Application No.: US14268221Application Date: 2014-05-02
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Publication No.: US09278368B2Publication Date: 2016-03-08
- Inventor: Andreas Bibl , Kevin von Essen , Paul A. Hoisington
- Applicant: FUJIFILM Dimatix, Inc.
- Applicant Address: US NH Lebanon
- Assignee: FUJIFILM Dimatix, Inc.
- Current Assignee: FUJIFILM Dimatix, Inc.
- Current Assignee Address: US NH Lebanon
- Agency: Fish & Richardson P.C.
- Main IPC: B41J2/015
- IPC: B41J2/015 ; B05B12/04 ; B41J2/14

Abstract:
A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.
Public/Granted literature
- US20140239089A1 MEMS Jetting Structure For Dense Packing Public/Granted day:2014-08-28
Information query
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