A laser machining apparatus includes a laser nozzle for supplying an assistive gas to remove undesirable materials and applying a laser beam at an angle, which is inclined with respect to a surface of a workpiece, a sputter blocking jig disposed over a region of the workpiece that is irradiated with the laser beam, so as to lie across directions in which the laser beam is scattered, and for blocking sputtered particles that are generated from the surface by the applied laser beam, and a joint connecting the laser nozzle and the sputter blocking jig to each other. The joint moves the laser nozzle and the sputter blocking jig in synchronism with each other.