Invention Grant
- Patent Title: CMP slurry particle breakup
- Patent Title (中): CMP浆料颗粒分解
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Application No.: US14048967Application Date: 2013-10-08
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Publication No.: US09278423B2Publication Date: 2016-03-08
- Inventor: William Weilun Hong , Kuo-Min Lin , Ying-Tsung Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: B24B57/02
- IPC: B24B57/02 ; B01D29/52 ; B24B37/04
Abstract:
A method for breaking up Chemical Mechanical Polishing (CMP) slurry particles includes receiving a CMP slurry comprising particles suspended in a solution, placing the slurry into a first agitation tank, and agitating the slurry at a first frequency. The first frequency is selected to break up particles having a size within a specified range.
Public/Granted literature
- US20150099431A1 CMP Slurry Particle Breakup Public/Granted day:2015-04-09
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