Invention Grant
- Patent Title: Receiving device for receiving semiconductor substrates
- Patent Title (中): 用于接收半导体衬底的接收装置
-
Application No.: US13138902Application Date: 2010-03-31
-
Publication No.: US09278433B2Publication Date: 2016-03-08
- Inventor: Herbert Tiefenböck , Jürgen Burggraf , Stefan Pargfrieder , Daniel Burgstaller
- Applicant: Herbert Tiefenböck , Jürgen Burggraf , Stefan Pargfrieder , Daniel Burgstaller
- Applicant Address: AT St. Florian am Inn
- Assignee: EV GROUP GMBH
- Current Assignee: EV GROUP GMBH
- Current Assignee Address: AT St. Florian am Inn
- Agency: Kusner & Jaffe
- Priority: DE10-2009-018-434 20090422
- International Application: PCT/EP2010/002052 WO 20100331
- International Announcement: WO2010/121701 WO 20101028
- Main IPC: B25B11/00
- IPC: B25B11/00 ; H01L21/683
Abstract:
A workholding fixture for holding flat semiconductor substrates with a carrier, a holding body which is fixed or which can be fixed on the carrier with a holding side which faces away from the carrier and at least one negative pressure channel which penetrates the holding body with one suction end on the holding side, the holding side having a defined suction structure of soft material.
Public/Granted literature
- US20120146273A1 RECEIVING DEVICE FOR RECEIVING SEMICONDUCTOR SUBSTRATES Public/Granted day:2012-06-14
Information query
