Invention Grant
- Patent Title: Additive layer fabrication method
- Patent Title (中): 添加剂层制造方法
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Application No.: US13318947Application Date: 2010-04-27
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Publication No.: US09278483B2Publication Date: 2016-03-08
- Inventor: Andrew David Wescott , Benjamin Richard Moreland , Jagjit Sidhu
- Applicant: Andrew David Wescott , Benjamin Richard Moreland , Jagjit Sidhu
- Applicant Address: GB London
- Assignee: BAE SYSTEMS PLC
- Current Assignee: BAE SYSTEMS PLC
- Current Assignee Address: GB London
- Agency: Maine Cernota & Rardin
- Priority: EP09275030 20090428; GB0907226.5 20090428
- International Application: PCT/GB2010/050686 WO 20100427
- International Announcement: WO2010/125381 WO 20101104
- Main IPC: B23K26/342
- IPC: B23K26/342 ; B29C67/00 ; B22F3/105 ; B23K35/02 ; B23K26/32 ; C23C24/00 ; C23C16/48

Abstract:
A selective layer melting or other additive layer fabrication method in which powdered material is fused by heating it with a pulsed laser, the pulses being modulated while the laser is traversing the substrate so as to control the thickness and/or width of the layer being formed. Initial layers of the fabrication structure may be formed more thickly than subsequent layers, e.g. by means of a CW laser, to reduce distortion. This aspect of the invention may be employed independently of the use of a pulsed laser to form the subsequent layers.
Public/Granted literature
- US20120132631A1 ADDITIVE LAYER FABRICATION METHOD Public/Granted day:2012-05-31
Information query
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