Invention Grant
- Patent Title: Friction stir welding structure and power semiconductor device
- Patent Title (中): 摩擦搅拌焊接结构和功率半导体器件
-
Application No.: US14235644Application Date: 2012-08-09
-
Publication No.: US09278503B2Publication Date: 2016-03-08
- Inventor: Toshio Hori , Keiichi Uraki , Masato Higuma , Yujiro Kaneko , Satoshi Hirano , Akihiro Sato
- Applicant: Toshio Hori , Keiichi Uraki , Masato Higuma , Yujiro Kaneko , Satoshi Hirano , Akihiro Sato
- Applicant Address: JP Hitachinaka-shi
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Hitachinaka-shi
- Agency: Crowell & Moring LLP
- Priority: JP2011-179706 20110819
- International Application: PCT/JP2012/070360 WO 20120809
- International Announcement: WO2013/027600 WO 20130228
- Main IPC: B23K20/12
- IPC: B23K20/12 ; B32B15/01 ; H01L23/10 ; H01L23/34 ; H01L23/473
Abstract:
A friction stir welding structure is comprised of a first and a second member integrated into one piece by friction stir welding, and in which a thin section is formed along the friction stir weld section on at least one of either of the first and the second member.
Public/Granted literature
- US20140210070A1 Friction Stir Welding Structure and Power Semiconductor Device Public/Granted day:2014-07-31
Information query
