Invention Grant
US09278505B2 Thermosetting resin composition and prepreg and metal clad laminate using the same
有权
热固性树脂组合物和使用其的预浸料和金属覆层层压板
- Patent Title: Thermosetting resin composition and prepreg and metal clad laminate using the same
- Patent Title (中): 热固性树脂组合物和使用其的预浸料和金属覆层层压板
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Application No.: US13984990Application Date: 2012-07-20
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Publication No.: US09278505B2Publication Date: 2016-03-08
- Inventor: Hee-Yong Shim , Jung-Jin Shim , Jeong-An Kang , Hyun-Sung Min
- Applicant: Hee-Yong Shim , Jung-Jin Shim , Jeong-An Kang , Hyun-Sung Min
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: KR10-2011-0072874 20110722; KR10-2012-0079208 20120720
- International Application: PCT/KR2012/005826 WO 20120720
- International Announcement: WO2013/015577 WO 20130131
- Main IPC: B32B17/04
- IPC: B32B17/04 ; C08L63/00 ; D06N3/12 ; B32B15/092 ; H05K1/03 ; C08J5/24
Abstract:
The present invention relates to a thermosetting resin composition used in a printed circuit board for a semiconductor package, and a prepreg and a metal clad laminate using the same. More particularly, the present invention provides a thermosetting resin composition that includes a mixture of a BT or cyanate resin and an epoxy resin and a specific content of a novolac resin as a curing agent so as to inhibit separation of the resin and an inorganic filler during a process of laminating a prepreg on a metal foil, thereby providing a printed circuit board having a uniform insulation layer, and a prepreg and a metal clad laminate for a double-sided or multilayer printed circuit board that are manufactured by using the same.
Public/Granted literature
- US20130319609A1 THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL CLAD LAMINATE USING THE SAME Public/Granted day:2013-12-05
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