Invention Grant
- Patent Title: Modular printhead sub-assembly
- Patent Title (中): 模块化打印头子组件
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Application No.: US14513793Application Date: 2014-10-14
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Publication No.: US09278526B1Publication Date: 2016-03-08
- Inventor: Chad Johan Slenes , Samuel Vincent Schultz , William Bruce Weaver , Jon Garret Judge
- Applicant: XEROX CORPORATION
- Applicant Address: US CT Norwalk
- Assignee: XEROX CORPORATION
- Current Assignee: XEROX CORPORATION
- Current Assignee Address: US CT Norwalk
- Agency: MH2 Technology Law Group LLP
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14 ; B41J2/16

Abstract:
A printhead for a printer and methods for making the printhead. The printhead may include a driver module on a jetstack. The jetstack may include a plurality of holes formed therethrough. A first adhesive layer may be disposed on the jetstack. A diaphragm plate may be disposed on the first adhesive layer. A piezoelectric layer may be disposed on the diaphragm plate. A second adhesive layer may be disposed on the piezoelectric layer. A chip on flex may be disposed on the second adhesive layer.
Information query
IPC分类: