Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US14497087Application Date: 2014-09-25
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Publication No.: US09278528B2Publication Date: 2016-03-08
- Inventor: Fujio Akahane
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2011-062531 20110322
- Main IPC: B41J2/15
- IPC: B41J2/15 ; B41J2/14

Abstract:
A liquid ejecting head includes: a flow channel member made of silicon; a nozzle plate made of silicon; a manifold member, which cooperates with the flow channel member to define a manifold in fluid communication with a plurality of pressure generation chambers; and a cover member, wherein the cover member is made of a different material than the nozzle plate, and wherein the cover member is affixed to the surface of the flow channel member that is affixed to the nozzle plate. The cover member fluidly blocks the manifold from the ambient atmosphere.
Public/Granted literature
- US20150077472A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2015-03-19
Information query
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