Invention Grant
- Patent Title: Bumper component with embedded sensor
- Patent Title (中): 带嵌入式传感器的保险杠部件
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Application No.: US14258713Application Date: 2014-04-22
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Publication No.: US09278659B2Publication Date: 2016-03-08
- Inventor: Steven Yellin Schondorf , Abraham G. Philip , Mahmoud Yousef Ghannam , Markus Hagen , Thomas Arndt
- Applicant: FORD GLOBAL TECHNOLOGIES, LLC
- Applicant Address: US MI Dearborn
- Assignee: Ford Global Technologies, LLC
- Current Assignee: Ford Global Technologies, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Brooks Kushman P.C.
- Agent Frank A. MacKenzie
- Main IPC: B60R21/0134
- IPC: B60R21/0134 ; B60R19/48 ; B60R19/02 ; B29C45/14 ; B29C45/16 ; B60R21/00 ; B29L31/34 ; B29L31/30

Abstract:
Exemplary methods of making a bumper component are disclosed, along with exemplary bumper assemblies and vehicles. An exemplary method may include providing a first mold portion defining at least in part a front surface, and positioning at least one sensor in the first mold portion. Exemplary methods may further include enclosing the at least one sensor within the first mold portion with a second mold portion. The second mold portion may define at least in part a rear surface. The method may further include forming a body within the first and second mold portions, thereby embedding the at least one sensor between the front and rear surfaces, the body extending between the front and rear surfaces.
Public/Granted literature
- US20150298635A1 BUMPER COMPONENT WITH EMBEDDED SENSOR Public/Granted day:2015-10-22
Information query
IPC分类: