Invention Grant
- Patent Title: Process liquid changing method and substrate processing apparatus
- Patent Title (中): 工艺液体更换方法和基板处理装置
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Application No.: US13774091Application Date: 2013-02-22
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Publication No.: US09278768B2Publication Date: 2016-03-08
- Inventor: Masatoshi Kasahara , Shinichiro Shimomura
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2012-038597 20120224
- Main IPC: H01L21/304
- IPC: H01L21/304 ; B65B3/04 ; H01L21/67

Abstract:
A process liquid changing method is provided for changing process liquids in a substrate processing apparatus including storage tank, a circulation line with a circulation pump, and a process liquid supply nozzle connected to the circulation line through a branch line. The method includes: discharging the process liquid in the storage tank; discharging a process liquid remaining in the circulation line from a drain connected to the circulation line at a second position of the circulation line, while supplying a purge gas to the circulation line at a first position of the circulation line, wherein the first position is located upstream of a junction area where the branch line is connected to the circulation line, and the second position is located downstream of the junction area and upstream of the storage tank; and supplying a process liquid into the storage tank.
Public/Granted literature
- US20130220478A1 PROCESS LIQUID CHANGING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2013-08-29
Information query
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