Invention Grant
- Patent Title: Manufacturing process of MEMS device
- Patent Title (中): MEMS器件制造工艺
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Application No.: US14256112Application Date: 2014-04-18
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Publication No.: US09278853B2Publication Date: 2016-03-08
- Inventor: Yu-Hao Chien , Hua-Shu Wu , Shih-Yung Chung , Li-Tien Tseng , Yu-Te Yeh
- Applicant: MIRADIA, INC.
- Applicant Address: CN Suzhou
- Assignee: MiraMEMS Sensing Technology Co., Ltd.
- Current Assignee: MiraMEMS Sensing Technology Co., Ltd.
- Current Assignee Address: CN Suzhou
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81C1/00
Abstract:
A manufacturing process of a MEMS device divides a substrate for fabricating a MEMS component into two electrically isolated regions, so that the MEMS component and the circuit disposed on its surface could connect electrically with another substrate below respectively through the corresponding conducing regions, whereby the configuration of the electrical conducting paths and the manufacturing process are simplified. A MEMS device manufactured by using the aforementioned process is also disclosed herein.
Public/Granted literature
- US20140227817A1 MANUFACTURING PROCESS OF MEMS DEVICE Public/Granted day:2014-08-14
Information query
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