Invention Grant
- Patent Title: Method of printing decorations on substrates
- Patent Title (中): 在基材上印刷装饰的方法
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Application No.: US14513407Application Date: 2014-10-14
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Publication No.: US09278884B2Publication Date: 2016-03-08
- Inventor: Tzu-Han Chen , Christopher Morton Lee , Yongsheng Yan
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- Agent John T. Haran
- Main IPC: C03C17/00
- IPC: C03C17/00 ; B41J11/00 ; B44F3/00 ; B41M5/24 ; B41M7/00
Abstract:
A method of printing a decoration on a substrate includes applying an ink coating in a predetermined design on the substrate by inkjet printing. The ink coating is cured to form a cured ink coating, and a portion of the cured ink coating is trimmed. Residual ink particles generated by the trimming are cleaned off the substrate. A printed substrate includes a substrate and a decoration printed on the substrate. The decoration comprises at least one layer of an inkjet-printed ink coating free of a saw edge and having a thickness in a range from 1.5 μm to 5 μm.
Public/Granted literature
- US20150103123A1 METHOD OF PRINTING DECORATIONS ON SUBSTRATES Public/Granted day:2015-04-16
Information query
