Invention Grant
- Patent Title: Anisotropic conductive adhesive, method of producing the same, connection structure and producing method thereof
- Patent Title (中): 各向异性导电胶，其制造方法，连接结构及其制造方法
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Application No.: US13703962Application Date: 2011-06-28
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Publication No.: US09279070B2Publication Date: 2016-03-08
- Inventor: Jun Sakamoto , Misao Konishi
- Applicant: Jun Sakamoto , Misao Konishi
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2010-153825 20100706
- International Application: PCT/JP2011/064796 WO 20110628
- International Announcement: WO2012/005144 WO 20120112
- Main IPC: C09J9/02
- IPC: C09J9/02 ; H05K1/02 ; H01B1/22 ; C08K3/08 ; C09J11/00 ; C09J11/04 ; C08K9/02
Abstract:
In an anisotropic conductive adhesive including a magnetic powder such as nickel-coated resin particles used as conductive particles, the conductive particles are present in an insulating adhesive composition without being aggregated. The magnetic powder used as the conductive particles is at least partially composed of a magnetic material. In this case, demagnetization has been performed on the conductive particles in a powder form that have not been dispersed in the insulating adhesive composition, the conductive particles in a paste obtained by dispersing the conductive particles in the insulating adhesive composition, or the conductive particles in a film formed from the paste, before establishment of an anisotropic conductive connection using the anisotropic conductive adhesive.
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