Invention Grant
- Patent Title: Method for applying a diffusion barrier interlayer for high temperature components
- Patent Title (中): 应用高温部件用扩散阻挡层的方法
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Application No.: US12616599Application Date: 2009-11-11
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Publication No.: US09279187B2Publication Date: 2016-03-08
- Inventor: Ronghua Wei , Narayana S. Cheruvu
- Applicant: Ronghua Wei , Narayana S. Cheruvu
- Applicant Address: US TX San Antonio
- Assignee: SOUTHWEST RESEARCH INSTITUTE
- Current Assignee: SOUTHWEST RESEARCH INSTITUTE
- Current Assignee Address: US TX San Antonio
- Agency: Grossman, Tucker et al.
- Main IPC: C23C14/06
- IPC: C23C14/06 ; C23C14/08 ; C23C28/00 ; C23C4/08 ; C23C4/10 ; C23C14/00 ; C23C14/35 ; C23C28/04 ; F01D5/28 ; H01J37/34 ; C23C14/54

Abstract:
A coated substrate and a method of forming a diffusion barrier coating system between a substrate and a MCrAl coating, including a diffusion barrier coating deposited onto at least a portion of a substrate surface, wherein the diffusion barrier coating comprises a nitride, oxide or carbide of one or more transition metals and/or metalloids and a MCrAl coating, wherein M includes a transition metal or a metalloid, deposited on at least a portion of the diffusion barrier coating, wherein the diffusion barrier coating restricts the inward diffusion of aluminum of the MCrAl coating into the substrate.
Public/Granted literature
- US20110111190A1 Method For Applying A Diffusion Barrier Interlayer For High Temperature Components Public/Granted day:2011-05-12
Information query
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