Invention Grant
- Patent Title: Low density acoustical panels
- Patent Title (中): 低密度声学板
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Application No.: US14140177Application Date: 2013-12-24
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Publication No.: US09279250B2Publication Date: 2016-03-08
- Inventor: Anthony L. Wiker
- Applicant: Armstrong World Industries, Inc.
- Applicant Address: US DE Wilmington
- Assignee: Awi Licensing Company
- Current Assignee: Awi Licensing Company
- Current Assignee Address: US DE Wilmington
- Agent Craig M Sterner
- Main IPC: E04B1/84
- IPC: E04B1/84 ; E04B9/00 ; G10K11/162 ; D04H1/4209 ; D04H1/541 ; E04B1/74 ; E04B1/76
Abstract:
Described herein are building products comprising crimped bicomponent fibers and a non-woven fabric, which demonstrate, inter alia, improved acoustical performance. Methods of making and using the building products are also described.
Public/Granted literature
- US20150176279A1 LOW DENSITY ACOUSTICAL PANELS Public/Granted day:2015-06-25
Information query
IPC分类:
