A high heat dissipation lamp includes a base, a lower cover, and a substrate. The base is a hollow structure, inside the base is defined a first hole. The lower cover is a hollow structure aligned with the base, and inside the lower cover is defined a second hole. The substrate is clamped between the base and the lower cover, and has a first surface located toward the first hole and a second surface located toward the second hole. On the first surface are provided a plurality of light emitting diodes. The first and second surfaces of the substrate come into direct contact with the base and the first and second holes of the lower cover, so as to improve thermal convection performance. Besides, the base and the lower cover of the lamp are annular-shaped, which makes the lamp easy to manufacture while having a strengthen structure.