Invention Grant
- Patent Title: Light emitting module having heat conductive substrate
- Patent Title (中): 具有导热基板的发光模块
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Application No.: US14158144Application Date: 2014-01-17
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Publication No.: US09279575B2Publication Date: 2016-03-08
- Inventor: Takayoshi Moriyama , Kazunari Higuchi , Sumio Hashimoto , Shinichi Kumashiro
- Applicant: Toshiba Lighting & Technology Corporation , Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo JP Kanagawa-ken
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Lighting & Technology Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Lighting & Technology Corporation
- Current Assignee Address: JP Tokyo JP Kanagawa-ken
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2008-142063 20080530; JP2009-071276 20090324
- Main IPC: F21S4/00
- IPC: F21S4/00 ; H05K1/05 ; F21V29/00 ; F21S8/02 ; F21V19/00 ; F21V21/00 ; F21V17/12 ; F21Y101/02 ; H05K1/02

Abstract:
A substrate having a plurality of light-emitting elements mounted thereon is described. The substrate may be mounted in a lighting apparatus and may include a surface on which the plurality of light-emitting elements are mounted and one or more holes through which heat may be conducted from the first surface to another surface of the substrate. For example, a heat conductive and electrically non-conductive material may cover a surface of the one or more holes. According to some arrangements, the surface of the substrate may include an electrically non-conductive layer and an electrically conductive layer such that the electrically non-conductive layer is electrically isolated or separated from the electrically conductive layer.
Public/Granted literature
- US20140133165A1 Light Emitting Module Having Heat Conductive Substrate Public/Granted day:2014-05-15
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