An LED lighting device and a method for making the LED lighting device, the LED lighting device having a PCB positioned over a cooling substrate on the top of a metallic heat-dissipation lamp cup. LED light sources are provided on the PCB and are connected to a power supply. Screws are used to attach the PCB to the cooling substrate. At least one screw includes a screw head electrically connected to one of the positive electrode and the negative electrode, and a screw body electrically connected to the metallic heat-dissipation lamp cup, such that the at least one screw provides a bypass discharge path between the LED light sources and the metallic heat-dissipation lamp cup to release leakage current and to protect the LED light sources.