Invention Grant
US09279663B2 Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate
有权
在用于测量大而薄的衬底的形状和/或厚度的工具中折叠光学元件的方法和装置
- Patent Title: Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate
- Patent Title (中): 在用于测量大而薄的衬底的形状和/或厚度的工具中折叠光学元件的方法和装置
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Application No.: US13561377Application Date: 2012-07-30
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Publication No.: US09279663B2Publication Date: 2016-03-08
- Inventor: Chunhai Wang , Chunsheng Huang , Andrew An Zeng , Frederick Arnold Goodman , Shouhong Tang , Yi Zhang
- Applicant: Chunhai Wang , Chunsheng Huang , Andrew An Zeng , Frederick Arnold Goodman , Shouhong Tang , Yi Zhang
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01B9/02
- IPC: G01B9/02 ; G01B11/06 ; G01B11/24
Abstract:
A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.
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