Invention Grant
- Patent Title: Multichannel thermocouple compensation for three dimensional temperature gradient
- Patent Title (中): 多通道热电偶补偿三维温度梯度
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Application No.: US13797091Application Date: 2013-03-12
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Publication No.: US09279731B2Publication Date: 2016-03-08
- Inventor: Fred Dennis Egley , John Distinti , Peter Norton , Andrea Wang
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Beyer Law Group LLP
- Main IPC: G01K7/13
- IPC: G01K7/13 ; G01K1/02 ; G01K7/02

Abstract:
A method of using a thermocouple is provided. The method includes, but is not limited to, disposing at least one temperature sensor at each of two or more respective portions of an electrical connector adapted to receive thermocouple signals, measuring temperatures at the two or more portions, and calculating the temperatures at each terminal of the electrical connector based on measured temperature values of the two or more respective portions having the disposed temperature sensors. The method also includes, but is not limited to, calculating a cold junction temperature of a terminal for at least one thermocouple channel carrying the thermocouple signals based on measured or calculated temperature values of the terminals, or a combination thereof.
Public/Granted literature
- US20140269821A1 MULTICHANNEL THERMOCOUPLE COMPENSATION FOR THREE DIMENSIONAL TEMPERATURE GRADIENT Public/Granted day:2014-09-18
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